Industry & Speciality

Organic Substrate

Linxens designs innovative single-sided organic substrate as an alternative to 2-layer BT substrates


Linxens offers cost effective organic laminate solutions for medium pin count wire-bond packages such as LGA, BOC & WBCSP IC packages. 
Our continuous reel-to-reel process ensures the highest quality and consistency, while minimizing total cost of ownership and optimizing your production yield.

Key Features

  • Single-sided substrate with dual access to the conductive foil
  • Windows for chip mounting (exposed die pad) improving chip heat dissipation
  • Glass epoxy for thin packages: 75-250 µm
  • Copper micro-etching treatment to enhances adhesion in blind holes
  • Glass epoxy surface treatment (>25mj/m²) for reliable chip encapsulation
  • Signal Trace Width: min. 50 µm 
  • Trace to trace space: min. 50 µm

Technical Capabilities

  • Electro-plating: Ni/Au, Ni/Ag , Ni/Pd/Au
  • Photo-imageable solder masks (dry-film or ink)
  • Dielectric thickess options: 75, 110, 200 µm
  • High Tg substrate available 
  • Copper thickness: 12-70 µm range
  • Automatic optical inspection


  • MSL (Moisture Sensitivity Level): JEDEC Level 1/2/2a/3/4
  • UHAST (Unbiased Temperature Humidity) up to 85% RH / 110°C for 264 hrs
  • HTSL (High Temp Storage Life) up to 150°C / 1,000 hrs

Delivery Form Factor

  • R2R from 35-150 mm wide
  • Strips

Compliance Labels

  • Halogen free products
  • RoHS 2002/95/EC

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