Description
Linxens provides a wide range of printed circuits boards that are customized to meet the most difficult design requirements
Key Features
- Double-sided plated holes for PCB's
- Down to 75 µm glass epoxy for ultrathin applications
- Copper trace width and space: min 50 µm
Technical Capabilities
- Epoxy-glass FR4 G10 equivalent: 75, 110, 200 µm
- Mechanical vias down to 200 μm diameter
- Electro-plating: Ni/Au, Ni/Ag , Ni/Pd/Au
- OSP
- Photo-imageable solder masks (dry-film or ink)
- Copper thickness: range 12-70 µm
- Automatic optical inspection
Reliability
- MSL (Moisture Sensitivity Level): JEDEC Level 1/ 2/2a/3/4
- UHAST (Unbiased Temperature Humidity) up to 85% RH / 110°C for 264 hrs
- HTSL (High Temp Storage Life) up to 150°C / 1000 hrs
Delivery Form Factor
- R2R from 35-150 mm wide
- Strips
Compliance Labels
- Halogen free products
- RoHS 2002/95/EC
