Description
Linxens leverages stamping, electroplating and overmolding technologies to manufacture high-quality leadframes and precision components providing hybrid solutions for sensors and power IC packaging.
Key Features
- High-speed stamping
- Reel-to-reel stamping
- Precious metal savings through selective plating
Material
- 50 µm -500 µm
- CuFe
- CuFe2p
- CuSn6
- Stainless steel
Plating
- Selective plating
- Spot plating
- Au finish
- Pd finish
- Ag finish
Minimum Slit
- 150 µm