Linxens offers customized specialty solutions for integrated circuit substrates and thin printed circuit boards. These are used in a large range of industrial and consumer applications as well as various IC packaging platforms.
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Reel-to-reel stamping is the most cost-effective method for high quantity leadframe production
Linxens designs innovative single-sided organic substrate as an alternative to 2-layer BT substrates
Double-sided Plated Holes
Reel-to-reel printed circuits boards for high-volume production
Linxens fabricates flexible reel-to-reel printed circuits for high-volume production