Description
Linxens Palladium Gen3 is the industry reference for Palladium plating with Gold flash configuration beneath the Palladium layer for improved product cost-efficiency. Linxens Palladium Gen3 maintains the highest yield for wire bonding and optimal corrosion performance.
Key Features
- High corrosion resistance
- Easy integration of the module
- Featured for payment cards
- Contact solution
- Palladium layer
Options
- Micro-etched / Fully-etched logos
- Colored Tape: Red, blue, orange
Compliance Labels
- ISO 10373
- ISO 7810
References
Part Number
Module
Model
Cavity
Chip Dimension
9X12121
8
Palladium Gen3
Failed
3.6 X 3.65
9X16001
8
Palladium Gen3
Passed
3.6 X 3.6
9X16004
8
Palladium Gen3
Failed
4.8 X 4.8
9X23206
8
Palladium Gen3
Passed
3.8 X 6.6
9X23207
8
Palladium Gen3
Failed
5.6 X ≤ 8
9X13902
6
Palladium Gen3
Failed
3.2 X 3
9X13705
6
Palladium Gen3
Failed
3 X 3